Technical parameters/power supply voltage: 0.97V ~ 1.03V
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 676
Encapsulation parameters/Encapsulation: BBGA-676
External dimensions/packaging: BBGA-676
Physical parameters/operating temperature: 0℃ ~ 85℃
Other/Product Lifecycle: Active
Compliant with standards/RoHS standards: Non-Compliant
Compliant with standards/lead standards: Contains Lead
Customs information/ECCN code: 3A991D
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
XC7K160T-1FF676C
|
Xilinx | 完全替代 | BBGA-676 |
XC7K160T 1FF676C 磨码
|
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