Technical parameters/power supply voltage: 1.14V ~ 1.26V
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 196
Encapsulation parameters/Encapsulation: TFBGA-196
External dimensions/packaging: TFBGA-196
Physical parameters/operating temperature: -40℃ ~ 100℃
Other/Product Lifecycle: Active
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
XC6SLX9-2CPG196C
|
Xilinx | 完全替代 | TFBGA-196 |
XC6SLX9-2CPG196C 磨码
|
||
XC6SLX9-3CPG196C
|
Xilinx | 完全替代 | TFBGA-196 |
FPGA Spartan®-6 LX Family 9152 Cells 45nm (CMOS) Technology 1.2V 196Pin CSBGA
|
||
XC6SLX9-3CPG196I
|
Xilinx | 完全替代 | TFBGA-196 |
FPGA Spartan®-6 LX Family 9152 Cells 45nm (CMOS) Technology 1.2V 196Pin CSBGA
|
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