Technical parameters/power supply voltage: 1.14V ~ 1.26V
Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: FBGA-676
External dimensions/packaging: FBGA-676
Physical parameters/operating temperature: 0℃ ~ 85℃
Other/Product Lifecycle: Active
Compliant with standards/RoHS standards: Non-Compliant
Compliant with standards/lead standards: Contains Lead
Customs Information/Hong Kong Import and Export License: NLR
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
XC6SLX75-2FGG676C
|
Xilinx | 完全替代 | FBGA-676 |
XC6SLX75 2FGG676C 磨码
|
||
XC6SLX75-3FG676I
|
Xilinx | 完全替代 | FBGA-676 |
XC6SLX75 3FG676I 磨码
|
||
XC6SLX75-3FGG676C
|
Xilinx | 完全替代 | FBGA-676 |
FPGA, Spartan-6, DCM, PLL, 408 I/O, 400 MHz, 74637单元, 1.14 V至1.26 V, FBGA-676
|
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