Technical parameters/power supply voltage: 1.8 V
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 132
Encapsulation parameters/Encapsulation: TFBGA-132
External dimensions/packaging: TFBGA-132
Physical parameters/operating temperature: 0℃ ~ 70℃
Other/Product Lifecycle: Active
Other/Packaging Methods: Tray
Compliant with standards/RoHS standards: Non-Compliant
Compliant with standards/lead standards: Contains Lead
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
|
|
Lattice Semiconductor | 完全替代 |
XC2C256 7CP132I 磨码
|
|||
XC2C256-7CP132I
|
Xilinx | 完全替代 | CSBGA-132 |
XC2C256 7CP132I 磨码
|
||
XC2C256-7CPG132I
|
Xilinx | 完全替代 | TFBGA-132 |
XC2C256 7CPG132I 磨码
|
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