Technical parameters/power supply voltage (DC): 2.50 V
Technical parameters/number of logic gates: 100000
Technical parameters/I/O pin count: 176
Technical parameters/power supply voltage: 2.375V ~ 2.625V
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 256
Encapsulation parameters/Encapsulation: FBGA-256
External dimensions/packaging: FBGA-256
Physical parameters/operating temperature: 0℃ ~ 85℃ (TJ)
Other/Product Lifecycle: Not Recommended
Other/Packaging Methods: Bulk
Compliant with standards/RoHS standards: Non-Compliant
Compliant with standards/lead standards: Contains Lead
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
XC2S100-5FGG256I
|
Xilinx | 完全替代 | BGA-256 |
XC2S100 5FGG256I 磨码
|
||
XC2S100-6FG256C
|
Xilinx | 完全替代 | FBGA-256 |
XC2S100 6FG256C 磨码
|
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