Encapsulation parameters/Encapsulation: Board
External dimensions/packaging: Board
Other/Product Lifecycle: Active
Other/Manufacturing Applications: Embedded Design & Development, Embedded Design and Development
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
Compliant with standards/REACH SVHC standards: No SVHC
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
USBMLPPCNEXUS
|
Freescale | 功能相似 |
NXP USBMLPPCNEXUS. 调试/编程接口, USB MULTILINK
|
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