Technical parameters/number of output interfaces: 1
Technical parameters/output voltage: 0.4V ~ 3.6V
Technical parameters/output current: 3 A
Technical parameters/switching frequency: 2.70 MHz
Technical parameters/topology structure: Buck
Technical parameters/input voltage (Max): 5.5 V
Technical parameters/input voltage (Min): 2.7 V
Technical parameters/output current (Max): 2.5 A
Technical parameters/operating temperature (Max): 90 ℃
Technical parameters/operating temperature (Min): -30 ℃
Technical parameters/power supply voltage: 2.7V ~ 5.5V
Technical parameters/input voltage: 5.5 V
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 16
Encapsulation parameters/Encapsulation: DSBGA-16
External dimensions/packaging: DSBGA-16
Physical parameters/operating temperature: -30℃ ~ 90℃
Other/Product Lifecycle: Active
Other/Packaging Methods: Tape & Reel (TR)
Other/Manufacturing Applications: mobile phone
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
LM3263TME/NOPB
|
TI | 类似代替 | DSBGA-16 |
LM3263高电流降压型DC - DC转换器, MIPI® RF前端控制接口的射频功率放大器 LM3263 High-Current Step-Down DC-DC Converter with MIPI® RF Front-End Control Interface for RF Power Amplifiers
|
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