Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: HBGA
External dimensions/packaging: HBGA
Other/Product Lifecycle: Unknown
Other/Packaging Methods: Tray
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
|
|
Microchip | 功能相似 | BGA-260 |
Phy With Rgmii And Rtbi Mac Interface 3.3V 260Pin HSBGA
|
||
VSC8244XHG
|
Vitesse | 功能相似 | HBGA |
Phy With Rgmii And Rtbi Mac Interface 3.3V 260Pin HSBGA
|
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