Technical parameters/tolerances: ±20 %
Technical parameters/inductance: 3.80 µH
Technical parameters/shielding: No
Technical parameters/Resistance (DC): ≤145 mΩ
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 12
Encapsulation parameters/Encapsulation: SMD-12
External dimensions/length: 13.0 mm
External dimensions/width: 12.9 mm
External dimensions/height: 6.20 mm
External dimensions/packaging: SMD-12
Physical parameters/operating temperature: -40℃ ~ 85℃
Other/Product Lifecycle: Unknown
Other/Packaging Methods: Tape & Reel (TR)
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
|
|
Eaton Bussmann | 功能相似 |
3.8uH ±20% 850mA
|
|||
VP1-0059-R
|
Cooper Bussmann | 功能相似 | SMD-12 |
Inductor Power Wirewound 3.8uH 20% Ferrite 850mA 145mOhm DCR T/R
|
||
VP1-0059-R
|
Coiltronics/Cooper Bussmann | 功能相似 | 0.508" L x 0.512" W x 0.244" H (12.90mm x 13.00mm x 6.20mm) |
Inductor Power Wirewound 3.8uH 20% Ferrite 850mA 145mOhm DCR T/R
|
||
VP1-0059-R
|
Eaton Bussmann | 功能相似 | SMD-12 |
Inductor Power Wirewound 3.8uH 20% Ferrite 850mA 145mOhm DCR T/R
|
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