Package parameters/number of pins: 256
Encapsulation parameters/Encapsulation: BGA
External dimensions/packaging: BGA
Other/Product Lifecycle: Obsolete
Compliant with standards/RoHS standards: Non-Compliant
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
XC2V250-5FG256I
|
Xilinx | 功能相似 | FBGA-256 |
可编程逻辑器件(CPLD/FPGA) XC2V250-5FG256I FBGA-256
|
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