Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: TSSOP-56
External dimensions/packaging: TSSOP-56
Other/Packaging Methods: Tray
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: PB free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
THC63LVDM83C-5S-B
|
California Eastern Laboratories | 功能相似 | TFSOP-56 |
IC XMITTER LVDS 56TSSOP
|
||
|
|
California Eastern Laboratories | 功能相似 | TFSOP-56 |
IC XMITTER LVDS 24B CLR 56TSSOP
|
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