Technical parameters/number of output interfaces: 8
Technical parameters/number of inputs: 56
Technical parameters/power supply voltage: 1.62V ~ 3.6V
Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: TFBGA-72
External dimensions/packaging: TFBGA-72
Physical parameters/operating temperature: -40℃ ~ 85℃ (TA)
Other/Product Lifecycle: Active
Compliant with standards/RoHS standards:
Compliant with standards/lead standards: lead-free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
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Advanced Thermal Solutions | 功能相似 | BGA |
Heatsink 70x70x25mm Xcut T766
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