Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 220
Encapsulation parameters/Encapsulation: BGA-220
External dimensions/packaging: BGA-220
Other/Product Lifecycle: Obsolete
Other/Packaging Methods: Tray
Compliant with standards/RoHS standards: Non-Compliant
Compliant with standards/lead standards: Contains Lead
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
|
|
Microsemi | 功能相似 | BGA-220 |
Switch Fabric 4K x 2K/1K x 1K 3.3V/5V 220Pin BGA Tray
|
||
|
|
Microchip | 功能相似 | BGA |
Switch Fabric 4K x 2K/1K x 1K 3.3V/5V 220Pin BGA Tray
|
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