Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 256
Encapsulation parameters/Encapsulation: BGA-256
External dimensions/packaging: BGA-256
Other/Product Lifecycle: Obsolete
Other/Packaging Methods: Tray
Compliant with standards/RoHS standards: Non-Compliant
Compliant with standards/lead standards: Contains Lead
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
ZL50018GAG2
|
Microsemi | 功能相似 | BGA-256 |
Switch Fabric 2K x 2K 1.8V/3.3V 256Pin BGA Tray
|
||
ZL50020GAG2
|
Microsemi | 功能相似 | BGA-256 |
Switch Fabric 2K x 2K 1.8V/3.3V 256Pin BGA Tray
|
||
|
|
Microchip | 功能相似 | BGA-256 |
Switch Fabric 2K x 2K 1.8V/3.3V 256Pin BGA Tray
|
||
|
|
Microchip | 功能相似 | BGA |
Switch Fabric 12K x 12K/8K x 8K/8K x 4K/4K x 8K/4K x 4K 1.8V/3.3V 256Pin BGA Tray
|
||
ZL50058GAG2
|
Microsemi | 功能相似 | BGA-256 |
Switch Fabric 12K x 12K/8K x 8K/8K x 4K/4K x 8K/4K x 4K 1.8V/3.3V 256Pin BGA Tray
|
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