Technical parameters/resistance: 20 kΩ
Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation (metric): 3216
Encapsulation parameters/Encapsulation: 1206
External dimensions/length: 3.2 mm
External dimensions/width: 1.6 mm
Dimensions/Packaging (Metric): 3216
External dimensions/packaging: 1206
Physical parameters/operating temperature: -55℃ ~ 150℃
Physical parameters/temperature coefficient: ±0.2 ppm/℃
Other/Product Lifecycle: Active
Other/Packaging Methods: Tray
Compliant with standards/RoHS standards: Non-Compliant
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
Y162520K0000T9R
|
Vishay Dale | 完全替代 |
Res Metal Foil 1206 20KΩ 0.01% 1/3W ±0.2ppm/℃ Molded SMD T/R
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Vishay Semiconductor | 完全替代 |
Res Metal Foil 1206 20KΩ 0.01% 3/10W ±0.2ppm/℃ Molded SMD SMD Waffle Pack
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Vishay Precision Group | 完全替代 | 1206 |
Res Metal Foil 1206 20KΩ 0.01% 3/10W ±0.2ppm/℃ Molded SMD SMD Waffle Pack
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