Encapsulation parameters/Encapsulation: SMD
External dimensions/packaging: SMD
Other/Military Standards: MIL-PRF-55182
Other/Package Types: SMD
Other/Max Processing Temps: 230 to 260|260 °C
Other/Product Dimensions: mm
Other/Lead Finish: Tin
Other/Type: Metal Foil
Other/ECCN: EAR99
Compliant with standards/RoHS standards: RoHS Compliant
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