Technical parameters/halogen-free state: Not Halogen Free
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 256
Encapsulation parameters/Encapsulation: BGA-256
External dimensions/packaging: BGA-256
Physical parameters/operating temperature: 0℃ ~ 95℃ (TA)
Other/Product Lifecycle: Obsolete
Other/Packaging Methods: Tray
Compliant with standards/RoHS standards: Non-Compliant
Compliant with standards/lead standards: Contains Lead
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
MPC850ZQ50BU
|
NXP | 完全替代 | BGA-256 |
MPU PowerQUICC MPC8xx Processor RISC 32Bit 50MHz 3.3V/5V 256Pin BGA Tray
|
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