Technical parameters/RAM size: 16K x 8
Package parameters/number of pins: 38
Encapsulation parameters/Encapsulation: TSSOP-38-9
External dimensions/packaging: TSSOP-38-9
Physical parameters/operating temperature: -40℃ ~ 85℃ (TA)
Other/Product Lifecycle: Obsolete
Other/Packaging Methods: Tape & Reel (TR)
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
XMC1201T038F0064ABXUMA1
|
Infineon | 类似代替 | TSSOP-38-9 |
ARM微控制器 - MCU XMC1000
|
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