Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 256
Encapsulation parameters/Encapsulation: LBGA-256
External dimensions/packaging: LBGA-256
Physical parameters/operating temperature: -40℃ ~ 85℃ (TA)
Other/Product Lifecycle: Active
Other/Packaging Methods: Tray
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
Customs Information/Hong Kong Import and Export License: NLR
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
XCR3384XL-10FT256I
|
Xilinx | 功能相似 | LBGA-256 |
XCR3384XL 10FT256I 磨码
|
||
XCR3384XL-12FTG256I
|
Xilinx | 功能相似 | LBGA-256 |
CPLD CoolRunner XPLA3 Family 9K Gates 384 Macro Cells 83MHz 0.35um (CMOS) Technology 3.3V 256Pin FTBGA
|
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