Technical parameters/power supply voltage: 3.3 V
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 48
Encapsulation parameters/Encapsulation: FBGA-48
External dimensions/packaging: FBGA-48
Physical parameters/operating temperature: -40℃ ~ 85℃ (TA)
Other/Product Lifecycle: Active
Other/Packaging Methods: Tray
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
XCR3032XL-10CS48I
|
Xilinx | 完全替代 | CSBGA-48 |
XCR3032XL 10CS48I 磨码
|
||
XCR3032XL-7CS48C
|
Xilinx | 完全替代 | FBGA-48 |
XCR3032XL 7CS48C 磨码
|
||
XCR3032XL-7CSG48C
|
Xilinx | 完全替代 | FBGA-48 |
XCR3032XL 7CSG48C 磨码
|
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