Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 144
Encapsulation parameters/Encapsulation: TFBGA-144
External dimensions/packaging: TFBGA-144
Physical parameters/operating temperature: 0℃ ~ 70℃ (TA)
Other/Product Lifecycle: Active
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
XCR3128XL-10CSG144C
|
Xilinx | 功能相似 | CSP-144 |
XCR3128XL 10CSG144C 磨码
|
||
XCR3128XL-7CS144C
|
Xilinx | 类似代替 | TFBGA-144 |
XCR3128XL 7CS144C 磨码
|
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