Technical parameters/power supply voltage (DC): 2.50 V
Technical parameters/I/O pin count: 192
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 256
Encapsulation parameters/Encapsulation: BGA-256
External dimensions/packaging: BGA-256
Physical parameters/operating temperature: 0℃ ~ 70℃ (TA)
Other/Product Lifecycle: Obsolete
Other/Packaging Methods: Tray
Compliant with standards/RoHS standards: Non-Compliant
Compliant with standards/lead standards: Contains Lead
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
XC95288XV-10FG256I
|
Xilinx | 类似代替 | FBGA-256 |
XC95288XV-10FG256I 磨码
|
||
XC95288XV-6FG256C
|
Xilinx | 类似代替 | FBGA |
XC95288XV-6FG256C 磨码
|
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