Technical parameters/power supply voltage: 3.3 V
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 256
Encapsulation parameters/Encapsulation: BGA-256
External dimensions/packaging: BGA-256
Physical parameters/operating temperature: -40℃ ~ 85℃
Other/Product Lifecycle: Active
Other/Packaging Methods: Tray
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
XC95288XL-10BGG256C
|
Xilinx | 完全替代 | PBGA-256 |
XC95288XL 10BGG256C 磨码
|
||
XC95288XL-10BGG256I
|
Xilinx | 完全替代 | BGA-256 |
XC95288XL 10BGG256I 磨码
|
||
XC95288XL-7BG256C
|
Xilinx | 完全替代 | BGA-256 |
XC95288XL 7BG256C 磨码
|
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