Technical parameters/number of pins: 225
Technical parameters/RAM size: 256 KB
Package parameters/number of pins: 225
Encapsulation parameters/Encapsulation: LFBGA-225
External dimensions/packaging: LFBGA-225
Physical parameters/operating temperature: -40℃ ~ 100℃
Other/Product Lifecycle: Active
Other/Packaging Methods: Tray
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
XC7Z010-1CLG225C
|
Xilinx | 完全替代 | LFBGA-225 |
PSoC/MPSoC微处理器, Zynq-7000 XC7Z010系列, ARM Cortex-A9,667 MHz, CSBGA-225
|
||
XC7Z010-1CLG225C
|
Xilinx | 完全替代 | LFBGA-225 |
PSoC/MPSoC微处理器, Zynq-7000 XC7Z010系列, ARM Cortex-A9,667 MHz, CSBGA-225
|
||
XC7Z010-2CLG225I
|
Xilinx | 完全替代 | LFBGA-225 |
PSoC/MPSoC微处理器, Zynq-7000 XC7Z010系列, ARM Cortex-A9,766 MHz, CSBGA-225
|
||
XC7Z010-2CLG225I
|
Xilinx | 完全替代 | LFBGA-225 |
PSoC/MPSoC微处理器, Zynq-7000 XC7Z010系列, ARM Cortex-A9,766 MHz, CSBGA-225
|
||
XC7Z010-3CLG225E
|
Xilinx | 完全替代 | LFBGA-225 |
XC7Z010 3CLG225E 磨码
|
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