Technical parameters/RAM size: 768 x 8
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 38
Encapsulation parameters/Encapsulation: TSSOP-38
External dimensions/packaging: TSSOP-38
Physical parameters/operating temperature: -40℃ ~ 150℃ (TA)
Other/Product Lifecycle: Not For New Designs
Other/Packaging Methods: Tape & Reel (TR)
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: lead-free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
XC866L4FRA3VBELXUMA1
|
Infineon | 完全替代 | TSSOP-38 |
8位微控制器 -MCU 8 BIT FLASH
|
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