Technical parameters/RAM size: 512 x 8
Technical parameters/Analog to Digital Conversion (ADC): 1
Technical parameters/operating temperature (Max): 85 ℃
Technical parameters/operating temperature (Min): -40 ℃
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 16
Encapsulation parameters/Encapsulation: TSSOP-16
External dimensions/packaging: TSSOP-16
Physical parameters/operating temperature: -40℃ ~ 85℃ (TA)
Other/Product Lifecycle: Active
Other/Packaging Methods: Tape & Reel (TR)
Other/Manufacturing Applications: keil, Lauterbach, logo_smh_120, hitex, iar, Keil_logo_new, elnec, bpm_microsystems, zhiyuan_logo, Dave_Bench, xeltek, euros, altium, hilo-logo, port_logo, Phyton Inc., algocraft-Logo
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: lead-free
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