Technical parameters/power supply voltage: 1.14V ~ 1.26V
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 668
Encapsulation parameters/Encapsulation: BBGA-668
External dimensions/packaging: BBGA-668
Physical parameters/operating temperature: 0℃ ~ 85℃ (TJ)
Other/Product Lifecycle: Active
Compliant with standards/RoHS standards: Non-Compliant
Compliant with standards/lead standards:
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
|
|
TI | 完全替代 |
XC4VLX40 11FFG668C 磨码
|
|||
XC4VLX40-11FFG668C
|
Xilinx | 完全替代 | BBGA-668 |
XC4VLX40 11FFG668C 磨码
|
©Copyright 2013-2025 ICGOODFIND (Shenzhen) Electronics Technology Co., Ltd.
The most helpful review