Technical parameters/power supply voltage: 1.14V ~ 1.26V
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 456
Encapsulation parameters/Encapsulation: BBGA-456
External dimensions/packaging: BBGA-456
Physical parameters/operating temperature: 0℃ ~ 85℃ (TJ)
Other/Product Lifecycle: Active
Compliant with standards/RoHS standards: Non-Compliant
Compliant with standards/lead standards:
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
XC3S2000-4FGG456C
|
Xilinx | 类似代替 | FBGA-456 |
XC3S2000 4FGG456C 磨码
|
||
XC3S2000-4FGG456I
|
Xilinx | 完全替代 | BBGA-456 |
XC3S2000 4FGG456I 磨码
|
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