Technical parameters/power supply voltage: 1.425V ~ 1.575V
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 672
Encapsulation parameters/Encapsulation: BBGA-672
External dimensions/packaging: BBGA-672
Physical parameters/operating temperature: -40℃ ~ 100℃ (TJ)
Other/Product Lifecycle: Not Recommended
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
XC2VP7-5FF672I
|
Xilinx | 完全替代 | BBGA-672 |
FPGA Virtex-II Pro Family 11088 Cells 1050MHz 0.13um/90nm (CMOS) Technology 1.5V 672Pin FCBGA
|
||
XC2VP7-5FFG672I
|
Xilinx | 完全替代 | FCBGA-672 |
FPGA Virtex-II Pro Family 11088 Cells 1050MHz 0.13um/90nm (CMOS) Technology 1.5V 672Pin FCBGA
|
||
XC2VP7-6FFG672I
|
Xilinx | 完全替代 | BBGA-672 |
FPGA Virtex-II Pro Family 11088 Cells 1200MHz 0.13um/90nm (CMOS) Technology 1.5V 672Pin FCBGA
|
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