Technical parameters/power supply voltage: 2.375V ~ 2.625V
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 256
Encapsulation parameters/Encapsulation: BGA-256
External dimensions/packaging: BGA-256
Physical parameters/operating temperature: 0℃ ~ 85℃ (TJ)
Other/Product Lifecycle: Active
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
Customs Information/Hong Kong Import and Export License: NLR
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
XC2S100-5FGG256I
|
Xilinx | 完全替代 | BGA-256 |
XC2S100 5FGG256I 磨码
|
||
XCV100-4FG256C
|
Xilinx | 完全替代 | BGA-256 |
Ic Fpga 176 i/o 256fbga Ic Fpga 176 i/o 256fbga Ic Fpga 176 i/o 256fbga Ic Fpga 176 i/o 256fbga Ic Fpga 176 i/o 256fbga
|
||
XCV100-5FG256C
|
Xilinx | 完全替代 | BGA-256 |
FPGA Virtex Family 108.904K Gates 2700 Cells 294MHz 0.22um Technology 2.5V 256Pin FBGA
|
©Copyright 2013-2025 ICGOODFIND (Shenzhen) Electronics Technology Co., Ltd.
The most helpful review