Technical parameters/power supply voltage: 1.425V ~ 1.575V
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 256
Encapsulation parameters/Encapsulation: BGA-256
External dimensions/packaging: BGA-256
Physical parameters/operating temperature: 0℃ ~ 85℃ (TJ)
Other/Product Lifecycle: Obsolete
Other/Packaging Methods: Tray
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
XC2V500-4FGG256C
|
Xilinx | 完全替代 | BGA-256 |
FPGA Virtex-II Family 500K Gates 6912 Cells 650MHz 0.15um Technology 1.5V 256Pin FBGA
|
||
XC2V500-4FGG256I
|
Xilinx | 完全替代 | BGA-256 |
FPGA Virtex-II Family 500K Gates 6912 Cells 650MHz 0.15um Technology 1.5V 256Pin FBGA
|
||
XC2V500-5FGG256C
|
Xilinx | 完全替代 | BGA-256 |
FPGA Virtex-II Family 500K Gates 6912 Cells 750MHz 0.15um Technology 1.5V 256Pin FBGA
|
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