Technical parameters/power supply voltage (DC): 3.30 V, 3.60 V (max)
Technical parameters/memory capacity: 300000 B
Technical parameters/power supply voltage: 3V ~ 3.6V
Encapsulation parameters/installation method: Through Hole
Package parameters/number of pins: 8
Encapsulation parameters/Encapsulation: DIP-8
External dimensions/packaging: DIP-8
Physical parameters/operating temperature: 0℃ ~ 70℃
Other/Product Lifecycle: Obsolete
Other/Packaging Methods: Tube
Compliant with standards/RoHS standards: Non-Compliant
Compliant with standards/lead standards: Contains Lead
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
XC17S20XLPD8C
|
Xilinx | 类似代替 | DIP-8 |
可编程逻辑器件(CPLD/FPGA) XC17S20XLPD8C DIP-8
|
||
XC17S30XLPD8C
|
Xilinx | 完全替代 | DIP-8 |
PROM Serial 243.3Kbit 3.3V 8Pin PDIP
|
©Copyright 2013-2025 ICGOODFIND (Shenzhen) Electronics Technology Co., Ltd.
The most helpful review