Technical parameters/number of circuits: 1
Technical parameters/resistance: 10.0 kΩ
Technical parameters/resistance deviation: ±20 %
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 8
Encapsulation parameters/Encapsulation: SOIC
External dimensions/packaging: SOIC
Physical parameters/temperature coefficient: ±300 ppm/℃
Other/Product Lifecycle: Obsolete
Other/Packaging Methods: Tape
Compliant with standards/RoHS standards: Non-Compliant
Compliant with standards/lead standards: Contains Lead
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
X9C103SI
|
Xicor | 功能相似 | SOIC |
数控电位( XDCP ) Digitally Controlled Pot (XDCP)
|
||
|
|
Renesas Electronics | 功能相似 | SOP |
数控电位( XDCP ) Digitally Controlled Pot (XDCP)
|
||
X9C103SIZT1
|
Renesas Electronics | 功能相似 | SOIC-8 |
X9C103 系列 100 抽头 非易失性 10 Kohm 数字电位器 - SOIC-8
|
||
X9C103SZT1
|
Intersil | 功能相似 | SOIC-8 |
100抽头数字电位器(10K)
|
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