Encapsulation parameters/Encapsulation: VFBGA-78
External dimensions/packaging: VFBGA-78
Other/Product Lifecycle: Not For New Designs
Compliant with standards/RoHS standards:
Compliant with standards/lead standards: lead-free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
W631GG8KB15I TR
|
Winbond Electronics | 功能相似 | TFBGA-78 |
1G DDR3 SDRAM X8 667MHz IND
|
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