Technical parameters/digits: 16
Technical parameters/operating temperature (Max): 95 ℃
Technical parameters/operating temperature (Min): 0 ℃
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 96
Encapsulation parameters/Encapsulation: BGA-96
External dimensions/packaging: BGA-96
Other/Product Lifecycle: Active
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: lead-free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
W631GU6MB-12
|
Winbond Electronics | 功能相似 | BGA-96 |
DRAM Chip DDR3L SDRAM 1Gbit 64Mx16 1.35V 96Pin VFBGA
|
©Copyright 2013-2025 ICGOODFIND (Shenzhen) Electronics Technology Co., Ltd.
The most helpful review