Encapsulation parameters/Encapsulation: TBGA
External dimensions/packaging: TBGA
Other/Product Lifecycle: Obsolete
Compliant with standards/RoHS standards: RoHS Compliant
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
|
|
Winbond Electronics | 功能相似 | TBGA |
NOR Flash Serial-SPI 3V/3.3V 128M-bit 16M x 8 8.5ns
|
||
W25Q128FVCIG
|
Winbond Electronics | 功能相似 | TBGA-24 |
Flash, 128MX1, PBGA24, 8 X 6MM, GREEN, TFBGA-24
|
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