Encapsulation parameters/installation method: Through Hole
Other/Product Lifecycle: Active
Other/Packaging Methods: Bulk
Compliant with standards/RoHS standards:
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
ECK-ATS332ME
|
Panasonic | 功能相似 | Through Hole |
Cap Ceramic Suppression X1/Y2 0.0033uF 250VAC/440VAC Y5U 20% (12.5 X 7mm) Radial 7.5mm 125℃ Bulk
|
||
VY2332M41Y5US63V7
|
Vishay BC Components | 功能相似 | Through Hole |
Cap Ceramic Suppression X1/Y2 0.0033uF 440VAC/300VAC Y5U 20% (10.5 X 5mm) Radial 7.5mm 125C Bulk
|
||
|
|
VISHAY | 功能相似 | Radial |
Cap Ceramic Suppression X1/Y2 0.0033uF 440VAC/300VAC Y5U 20% (10.5 X 5mm) Radial 7.5mm 125C Bulk
|
||
VY2332M41Y5US63V7
|
Vishay Semiconductor | 功能相似 |
Cap Ceramic Suppression X1/Y2 0.0033uF 440VAC/300VAC Y5U 20% (10.5 X 5mm) Radial 7.5mm 125C Bulk
|
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