Encapsulation parameters/Encapsulation: Module
External dimensions/packaging: Module
Other/Product Lifecycle: Active
Other/Manufacturing Applications: Communication and Network
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: lead-free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
UMFT4222EV
|
FTDI Chip | 功能相似 | MODULE |
FTDI UMFT4222EV 开发板, USB至SPI/I2C桥接, 电池充电器检测
|
||
UMFT4222EV-B
|
FTDI Chip | 功能相似 | DIP-24 |
FTDI UMFT4222EV-B 开发板, USB 2.0-QSPI/I2C桥接, 28Mbps数据率, LDO带锁相环, CMOS输出
|
||
UMFT4222EV-D
|
FTDI Chip | 功能相似 |
开发板, FT4222H USB 2.0桥, QuadSPI, I2C
|
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