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Model UMFT601A
Description UMFT60x USB 3.0 The UMFT60xx bridge development board is an evaluation/development module with FMC (LPC)/HSMC connectors, used to connect FT60x USB 3.0 ultra high speed bridge chips with external hardware. The UMFT60xx chip can provide bridging between the FIFO bus and USB 3.0 host. These modules are designed to be compatible with most FPGA development platforms provided by suppliers such as Xilinx or Altera. Supports USB 3.0 ultra high speed (5Gbps)/USB 2.0 high speed (480Mbps)/USB 2.0 full speed (12Mbps) data transfer. The FIFO bus has 4 input channels and 4 output channels, supporting multiple voltage inputs/outputs: 1.8V, 2.5V, and 3.3V. The micro USB 3.0 socket is a high-speed connector used for FIFO bus: FMC (Field Programmable Mezzanine Card) or HSMC (High Speed Mezzanine Card). The FMC connector is compatible with most Xilinx FPGA reference design boards. The HSMC connector is compatible with most Altera FPGA reference design boards. Power options: external DC power supply USB bus power supply, FMC/HSMC power reset and wake-up button remote wake-up power LED * * RS product code * * UMFT600A 16 bit FIFO bus, HSMC connector 901-5054 UMFT601A 32-bit FIFO bus, HSMC connector 901-5058 UMFT600X 16 bit FIFO bus, FMC (LPC) connector 901-5067 UMFT601X 32-bit FIFO bus, FMC (LPC) connector 901-5060 # # # Serial input/output peripherals
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Brand: FTDI Chip
Packaging MODULE
Delivery time
Packaging method Bulk
Standard packaging quantity 1
461.65  yuan 461.65yuan
1+:
$ 530.8975
10+:
$ 517.0480
50+:
$ 506.4301
100+:
$ 502.7369
200+:
$ 499.9670
500+:
$ 496.2738
1000+:
$ 493.9655
2000+:
$ 491.6573
Quantity
1+
10+
50+
100+
200+
Price
$530.8975
$517.0480
$506.4301
$502.7369
$499.9670
Price $ 530.8975 $ 517.0480 $ 506.4301 $ 502.7369 $ 499.9670
Start batch production 1+ 10+ 50+ 100+ 200+
Check the distribution price
  • Freight charges：   In stock Freight rate：$13.00
  • Quantity： Inventory(8409) Minimum order quantity(1)
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Technical parameters/frequency: 100 MHz

Technical parameters/power supply voltage: 5 V

Encapsulation parameters/Encapsulation: Module

External dimensions/packaging: Module

Physical parameters/operating temperature: -40℃ ~ 85℃

Other/Product Lifecycle: Discontinued at Digi-Key

Other/Packaging Methods: Bulk

Other/Manufacturing Applications: Test & Measurement, Testing and Measurement, Industrial, Industrial

Compliant with standards/RoHS standards: RoHS Compliant

Compliant with standards/lead standards: Lead Free

Compliant with standards/REACH SVHC standards: No SVHC

Compliant with standard/REACH SVHC version: 2015/12/17

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Alternative material

Model Brand Similarity Encapsulation Introduction Data manual
UMFT601A-B UMFT601A-B FTDI Chip 完全替代 MODULE
评估板, FIFO至USB 3.0桥接, 32位先进先出总线, HSMC连接器, B版芯片
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