Technical parameters/Contact electroplating: Gold
Encapsulation parameters/installation method: Bulkhead, Panel
Physical parameters/contact material: Beryllium Copper
Other/Packaging Methods: Bulk
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
MC23557
|
Multicomp | 类似代替 |
MULTICOMP MC23557. 射频同轴连接器, BNC
|
©Copyright 2013-2025 ICGOODFIND (Shenzhen) Electronics Technology Co., Ltd.
The most helpful review