Encapsulation parameters/Encapsulation: DIP
External dimensions/packaging: DIP
Other/Product Lifecycle: Unknown
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
|
|
National Semiconductor | 功能相似 | DIP |
缓冲器/驱动器/收发器 100112DC CDIP-24
|
||
|
|
TI | 功能相似 | DIP |
缓冲器/驱动器/收发器 100112DC CDIP-24
|
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