Package parameters/number of pins: 9
Encapsulation parameters/Encapsulation: DIP
External dimensions/packaging: DIP
Other/Product Lifecycle: Unknown
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
RFB350-48S12-R5J
|
Emerson Network Power | 功能相似 | DIP-9 |
Module DC-DC 48Vin 1Out 7.2V to 13.2V 29.2A 350W 9Pin Half-Brick
|
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|
|
Emerson | 功能相似 |
Module DC-DC 48Vin 1Out 7.2V to 13.2V 29.2A 350W 9Pin Half-Brick
|
|||
|
|
Emerson | 功能相似 |
Module DC-DC 48Vin 1Out 7.2V to 13.2V 29.2A 350W 9Pin Half-Brick
|
|||
RFB350-48S12-R5Y
|
Artesyn Embedded Technologies | 功能相似 | Half-Brick |
Module DC-DC 48Vin 1Out 7.2V to 13.2V 29.2A 350W 9Pin Half-Brick
|
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