Technical parameters/number of contacts: 40
Technical parameters/polarity: Male
Technical parameters/Contact electroplating: Gold
Technical parameters/number of rows: 1
Encapsulation parameters/installation method: Through Hole
Packaging parameters/pin spacing: 2.54 mm
External dimensions/pin spacing: 2.54 mm
Physical parameters/contact material: Phosphor Bronze
Other/Product Lifecycle: Active
Other/Manufacturing Applications: Industrial
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/REACH SVHC standards: No SVHC
Compliant with standard/REACH SVHC version: 2015/06/15
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
TSW-140-25-L-S-RA
|
Samtec | 完全替代 |
SAMTEC TSW-140-25-L-S-RA 板至板连接, 直角, TSW系列, 40 触点, 针座, 2.54 mm, 通孔安装, 1 排
|
|||
TSW-140-25-S-S-RA
|
Samtec | 完全替代 |
Conn Unshrouded Header HDR 40POS 2.54mm Solder RA Thru-Hole
|
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TSW-140-25-T-S-RA
|
Samtec | 功能相似 |
SAMTEC TSW-140-25-T-S-RA Board-To-Board Connector, 2.54mm, 40Contacts, Header, TSW Series, Through Hole, 1Rows
|
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