Technical parameters/number of contacts: 17
Technical parameters/polarity: Male
Technical parameters/Contact electroplating: Tin
Technical parameters/number of rows: 1
Technical parameters/number of pins: 17
Technical parameters/rated current (Max): 6.3A/contact
Technical parameters/operating temperature (Max): 105 ℃
Technical parameters/operating temperature (Min): -55 ℃
Technical parameters/rated voltage (Max): 550 VAC
Encapsulation parameters/installation method: Through Hole
Encapsulation parameters/Encapsulation: -
Packaging parameters/pin spacing: 2.54 mm
External dimensions/length: 43.2 mm
External dimensions/width: 2.54 mm
External dimensions/height: 8.38 mm
External dimensions/packaging: -
External dimensions/pin spacing: 2.54 mm
Physical parameters/shell color: Black
Physical parameters/color: Black
Physical parameters/contact material: Phosphor Bronze
Physical parameters/operating temperature: -55℃ ~ 105℃
Physical parameters/shell material: Plastic
Other/Product Lifecycle: Active
Other/Packaging Methods: Bag
Other/Manufacturing Applications: -, Industrial
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
Compliant with standards/REACH SVHC standards: No SVHC
Compliant with standard/REACH SVHC version: 2015/06/15
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
22-28-4170
|
Molex | 类似代替 |
2.54毫米（ .100 ）间距KK®头，分离式，立式， 17电路，锡（ Sn）的接合处电镀引脚长度6.09毫米（ 0.240 ） 2.54mm (.100) Pitch KK® Header, Breakaway, Vertical, 17 Circuits, Tin (Sn) Plating Mating Pin Length 6.09mm (.240)
|
|||
22-28-4172
|
Molex | 类似代替 |
Conn Unshrouded Header HDR 17POS 2.54mm Solder ST Thru-Hole Bag
|
|||
TSW-117-26-T-S
|
Samtec | 完全替代 |
SAMTEC TSW-117-26-T-S Board-To-Board Connector, 2.54mm, 17Contacts, Header, TSW Series, Through Hole, 1Rows
|
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