Technical parameters/polarity: Male
Technical parameters/Contact electroplating: Tin
Technical parameters/number of rows: 2
Encapsulation parameters/installation method: Through Hole
Packaging parameters/pin spacing: 2.54 mm
External dimensions/pin spacing: 2.54 mm
Physical parameters/contact material: Phosphor Bronze
Other/Product Lifecycle: Active
Other/Packaging Methods: Bulk
Compliant with standards/RoHS standards: RoHS Compliant
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
TSW-108-08-T-D
|
Samtec | 完全替代 |
SAMTEC TSW-108-08-T-D Board-To-Board Connector, 2.54mm, 16Contacts, Header, TSW Series, Through Hole, 2Rows
|
|||
TSW-108-08-T-D-NA
|
Samtec | 完全替代 |
Conn Unshrouded Header HDR 16POS 2.54mm Solder RA Thru-Hole
|
|||
TSW-108-08-T-D-RA
|
Samtec | 完全替代 |
板至板连接, 2.54 mm, 16 触点, 针座, TSW Series, 通孔安装, 2 排
|
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