Technical parameters/power supply current: 250 µA
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 48
Encapsulation parameters/Encapsulation: TSSOP
External dimensions/packaging: TSSOP
Other/Product Lifecycle: Active
Other/Packaging Methods: Tube, Rail
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
TS3L301DGGRG4
|
TI | 完全替代 | TSSOP-48 |
16位到8位SPDT千兆网卡低收入和FLAT开关导通电阻 16-BIT TO 8-BIT SPDT GIGABIT LAN SWITCH WITH LOW AND FLAT ON-STATE RESISTANCE
|
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