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Model TPS62301DRCRG4
Description 500Milliampere, 3 MHz synchronous buck converter chip level package 500 mA, 3-mHz SYNC HRONUS STEP-DOWN CONVERTER IN CHIP SCALE PACKING
Product QR code
Brand: TI
Packaging VFDFN-10
Delivery time
Packaging method Tape & Reel (TR)
Standard packaging quantity 1
3.05  yuan 3.05yuan
5+:
$ 4.1108
25+:
$ 3.8063
50+:
$ 3.5931
100+:
$ 3.5018
500+:
$ 3.4409
2500+:
$ 3.3647
5000+:
$ 3.3343
10000+:
$ 3.2886
Quantity
5+
25+
50+
100+
500+
Price
$4.1108
$3.8063
$3.5931
$3.5018
$3.4409
Price $ 4.1108 $ 3.8063 $ 3.5931 $ 3.5018 $ 3.4409
Start batch production 5+ 25+ 50+ 100+ 500+
Check the distribution price
  • Freight charges：   In stock Freight rate：$13.00
  • Quantity： Inventory(9999) Minimum order quantity(5)
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Technical parameters/number of output interfaces: 1

Technical parameters/output voltage: 1.5 V

Technical parameters/output current: 500 mA

Technical parameters/Static current: 86.0 µA

Technical parameters/adjusted output number: 1

Technical parameters/switching frequency: 3 MHz

Technical parameters/topology structure: Buck

Technical parameters/input voltage (Max): 6 V

Technical parameters/input voltage (Min): 2.7 V

Technical parameters/output voltage (Min): 1.5 V

Technical parameters/output current (Max): 0.5 A

Technical parameters/operating temperature (Max): 85 ℃

Technical parameters/operating temperature (Min): -40 ℃

Technical parameters/input voltage: 2.7V ~ 6V

Encapsulation parameters/installation method: Surface Mount

Package parameters/number of pins: 10

Encapsulation parameters/Encapsulation: VFDFN-10

External dimensions/packaging: VFDFN-10

Physical parameters/operating temperature: -40℃ ~ 85℃ (TA)

Other/Product Lifecycle: Active

Other/Packaging Methods: Tape & Reel (TR)

Compliant with standards/RoHS standards: RoHS Compliant

Compliant with standards/lead standards: Lead Free

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Alternative material

Model Brand Similarity Encapsulation Introduction Data manual
TPS62301DRCRG4 TPS62301DRCRG4 TI 完全替代 VFDFN-10
500毫安， 3 MHz的同步降压转换器芯片级封装 500-mA, 3-MHz SYNCHRONOUS STEP-DOWN CONVERTER IN CHIP SCALE PACKAGING

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