Chip AI consultant
Technical parameters/number of output interfaces: 1
Technical parameters/output voltage: 2.15 V
Technical parameters/output current: 350 mA
Technical parameters/Static current: 31.0 µA
Technical parameters/adjusted output number: 1
Technical parameters/switching frequency: 6 MHz
Technical parameters/topology structure: Buck
Technical parameters/input voltage (Max): 5.5 V
Technical parameters/input voltage (Min): 2.3 V
Technical parameters/output voltage (Min): 2.15 V
Technical parameters/output current (Max): 0.35 A
Technical parameters/operating temperature (Max): 85 ℃
Technical parameters/operating temperature (Min): -40 ℃
Technical parameters/input voltage: 5.5 V
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 6
Encapsulation parameters/Encapsulation: XFBGA-6
External dimensions/packaging: XFBGA-6
Physical parameters/operating temperature: -40℃ ~ 85℃ (TA)
Other/Product Lifecycle: Active
Other/Packaging Methods: Tape & Reel (TR)
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
TPS62616YFDT
|
TI | 类似代替 | DSBGA-6 |
350毫安， 6 MHz的高效率降压转换器低姿态芯片级封装（高度\u003c 0.4mm间距） 350-mA, 6-MHz HIGH-EFFICIENCY STEP-DOWN CONVERTER IN LOW PROFILE CHIP SCALE PACKAGING (HEIGHT
|
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