Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: SOIC
External dimensions/packaging: SOIC
Other/Product Lifecycle: Active
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
TPS2068D
|
TI | 功能相似 | PowerPad-MSOP-8 |
Texas Instruments ### USB 电源和充电端口控制器,Texas Instruments
|
||
TPS2068DR
|
TI | 功能相似 | SOIC-8 |
1.5A、2.7V 至 5.5V、使能端低电平有效的 USB 电源开关 8-SOIC 0 to 70
|
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