Technical parameters/number of circuits: 1
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 10
Encapsulation parameters/Encapsulation: HVSSOP EP
External dimensions/packaging: HVSSOP EP
Other/Product Lifecycle: Active
Other/Packaging Methods: Tape & Reel (TR)
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
|
|
Rochester | 类似代替 |
耳机驱动器2 -W单声道音频功率放大器 2-W MONO AUDIO POWER AMPLIFIER WITH HEADPHONE DRIVE
|
|||
TPA0243DGQG4
|
TI | 类似代替 | PowerPad-MSOP-10 |
Audio Amp Headphone/Speaker 1CH Mono/2CH Stereo 2W Class-AB 10Pin HVSSOP EP Tube
|
||
TPA0243DGQR
|
TI | 类似代替 | PowerPad-MSOP-10 |
Audio Amp Headphone/Speaker 1CH Mono/2CH Stereo 2W Class-AB 10Pin HTSSOP EP T/R
|
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